Intel 18A Platform Technology Featuring RibbonFET (GAA) and PowerVia for Advanced High-Performance Computing

An advanced Intel 18A technology featuring RibbonFET and PowerVia provides over 30% density scaling and a full node of performance improvement compared to Intel 3. Intel 18A achieved 18%/25% performance (0.75V/1.1V) at iso-power over Intel 3 through an industry-first combination and optimization of advanced interconnects, a Gate-All-Around (GAA) transistor architecture, backside power, and design co-optimization. Intel 18A offers high-performance (HP) and high-density (HD) libraries with full-featured technology design capabilities and enhanced design ease of use.

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Published
2025-06-08
DOI
https://doi.org/10.23919/vlsitechnologyandcir65189.2025.11075006
Citations
8
Primary Topic
Parallel Computing and Optimization Techniques
Type
article
Field-Weighted Citation Impact
18.16
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article

Intel 18A Platform Technology Featuring RibbonFET (GAA) and PowerVia for Advanced High-Performance Computing

A. Dhar, W.M. Grimm, Andrew Jamieson, Cheng‐Yong Su et al.
8 citations
Parallel Computing and Optimization Techniques
18.16
article

Intel 18A Platform Technology Featuring RibbonFET (GAA) and PowerVia for Advanced High-Performance Computing

A. Dhar, W.M. Grimm, Andrew Jamieson, Cheng‐Yong Su, Irving T. Ho, M. Sriram, Muratahan Aykol, Zheng Guo, Hannes Greve, Pankaj Sinha, Markus J. Buehler, John Marcus Bell, Adrian Moore, A. Murugavel, Monika Sharma, Chandra Has Singh, M. Kobrinsky, Daniel Pantuso, W. Hafez, S. Kelgeri, J. Leib, B. Sell, Nathan Strutt, S. Mudanai, James D. Brooks, B. Guha, Lin Hu, Ryan Russell, H. Kothari, Steven Chin, Se‐Bum Paik, Chad Staus, Atsushi Tanaka, Neelam Sharma, Biswajit Sarkar, K. Beckwitt, Tingzeng Wu, J. Stoeger, A. Kim, Sabina Beranič Klopčič, Antoine Danon, S. Patil, K. Mistry, Sumit K. Mandal, Rajib Das, R. Mehandru, Dipto G. Thakurta, M. Weybright, William T. Blanton, S. Jaloviar, Daphne Lawrence, John Perkins, Chris Ward, B. Bains, R. Aggarwal, S. Burgess, Steven D. Kirby, Rajesh Patel, Eric Karl, Pallav Gupta, P. Amin, Conor Puls, Mange Ram Yadav, Daniel Schulman, Wei‐Ting Hsu, C. Auth, Chou‐Ching K. Lin, O. Golonzka, M. Hattendorf, Anupama Bowonder, Sashidhar S. Panchamgam, Martin Horsch, Charles H. Wallace, J. Hicks, Rony Ghostine, P. Elfick, Amitava Chatterjee, S. Mani, Saravanan Rajamani, Andrew J. Smith, K. Park, Akitomo Matsubayashi, Hyun‐Woo Shim, Dhananjay Bhawe, Joseph M. Steigerwald, Stefan Meister, Xielin Wang, M. Asoro, Barry R. Greene, Chun-Yu Lin, Pabitra Kumar Paul, K. Byon, R. Ramaswamy, T. Ghani, Gokul Malyavanatham, Ítala Paredes, Frank E. Abboud, C. Atay, D. A. Collins, D. Harris, C. Prasad, B. Marinkovic, Supratik Chakraborty, D. J. Towner, Leonard C. Pipes, J. Knudsen, Satyajit Anand, Edward J. McKenna, S Samant, Z. Zhang, S. Havelia, Neha Mehta, Fahim ur Rahman, K. Ganesan, Conghui Han, Shan Zhou, Guofeng Xu, Nilanjan Das, J. Birdsall, Bin Wang, J.R. Parker, Annmarie Kelleher, G. Freeman, M. B. Prince, James O. Bondi, J. Mehta, C.J. Choi, C-H. Lin, V. Mishra, K. Fischer, Tuck-Boon Chan, S. Natarajan, B. Parks, Arash Joushaghani, A. Badmaev, S. Rossow, O. Saadat, O. Sabih, S. Somaia, M. Von Haartmann, M. Bellah, J. Zavestoski, D. Casillas, S. Charue-bakker, D. Crum, R. Ehlert, V. Kamysbayev, S. Kobaku
article en
8 citations

Abstract

An advanced Intel 18A technology featuring RibbonFET and PowerVia provides over 30% density scaling and a full node of performance improvement compared to Intel 3. Intel 18A achieved 18%/25% performance (0.75V/1.1V) at iso-power over Intel 3 through an industry-first combination and optimization of advanced interconnects, a Gate-All-Around (GAA) transistor architecture, backside power, and design co-optimization. Intel 18A offers high-performance (HP) and high-density (HD) libraries with full-featured technology design capabilities and enhanced design ease of use.

Intel (United States) (US)
Affordable and clean energy
Openalex Percentile: Top 1%
Parallel Computing and Optimization Techniques
18.16
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