A Compact <i>D</i> -Band Stacked Power Amplifier With 16.1-dBm <i>P</i> <sub>sat</sub> and 636-mW/mm <sup>2</sup> Power Density

This letter presents a <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">D</i>-band power amplifier (PA) fabricated in 40-nm bulk CMOS technology. The proposed design employs a T-model analysis of the internal node between the common-source (CS) and common-gate (CG) transistors in the stacked-FET structure. Based on this analysis, an optimized T-network was implemented to mitigate phase misalignment, resulting in boosted output power and power-added efficiency (PAE). Measurement results demonstrate a saturated output power (<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$P_{\mathrm {sat}}$</tex-math> </inline-formula>) of 16.1 dBm, peak PAE of 12.5%, and a gain of 32.2 dB, achieving the highest reported power density of 636 mW/mm<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> among CMOS-based <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">D</i>-band PAs. It further supports 16-/64-QAM data rates of 16 and 12 Gb/s, respectively.

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Journal
IEEE Microwave and Wireless Technology Letters
Published
2025-08-04
DOI
https://doi.org/10.1109/lmwt.2025.3592858
Primary Topic
Radio Frequency Integrated Circuit Design
Type
article
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article

A Compact D -Band Stacked Power Amplifier With 16.1-dBm P sat and 636-mW/mm 2 Power Density

Jeongho Jang, Munkyo Seo, Jae-Gwan Kim, S. Son
IEEE Microwave and Wireless Technology Letters
Radio Frequency Integrated Circuit Design
article

A Compact D -Band Stacked Power Amplifier With 16.1-dBm P sat and 636-mW/mm 2 Power Density

Jeongho Jang, Munkyo Seo, Jae-Gwan Kim, S. Son
article en

Abstract

This letter presents a <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">D</i>-band power amplifier (PA) fabricated in 40-nm bulk CMOS technology. The proposed design employs a T-model analysis of the internal node between the common-source (CS) and common-gate (CG) transistors in the stacked-FET structure. Based on this analysis, an optimized T-network was implemented to mitigate phase misalignment, resulting in boosted output power and power-added efficiency (PAE). Measurement results demonstrate a saturated output power (<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$P_{\mathrm {sat}}$</tex-math> </inline-formula>) of 16.1 dBm, peak PAE of 12.5%, and a gain of 32.2 dB, achieving the highest reported power density of 636 mW/mm<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> among CMOS-based <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">D</i>-band PAs. It further supports 16-/64-QAM data rates of 16 and 12 Gb/s, respectively.

IEEE Microwave and Wireless Technology LettersVol. 35(11)
Sungkyunkwan University (KR)
Affordable and clean energy
Openalex Percentile: Top 82%
Radio Frequency Integrated Circuit Design
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A Compact <i>D</i> -Band Stacked Power Amplifier With 16.1-dBm <i>P</i> <sub>sat</sub> and 636-mW/mm <sup>2</sup> Power Density — Jeongho Jang, Munkyo Seo, et al. · IEEE Microwave and Wireless Technology Letters (2025) | TGRS Research Map | TGRS