Consistent glass transition temperature of epoxy resin by three different test methods on the same nanomechanical test instrument

Glass transition temperature (Tg) is a critical property of polymers that determines their service temperature. Various methods, such as differential thermal analysis (DTA), thermomechanical analysis (TMA), dynamic mechanical analysis (DMA), and thermal dilation analysis (TDA), are commonly used to measure Tg. Large discrepancies often arise due to differences in test conditions, sample sizes, Tg definition, and temperature calibration errors. These inconsistencies make it difficult for researchers to compare results and communicate effectively. To address this issue, an innovative approach by performing TDA, DMA, and TMA on the same nanomechanical test instrument was introduced. This approach measures the Tg of epoxy resin at microscale, eliminating errors from inter-instrument temperature discrepancies. Our results demonstrate that the Tg values obtained by different methods are practically the same when appropriate Tg definition, effective sample size and test conditions are applied. This approach will have a significant impact on polymer research.

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Publication Details

Journal
Discover Polymers.
Published
2025-08-04
DOI
https://doi.org/10.1007/s44347-025-00028-2
Citations
1
Primary Topic
Epoxy Resin Curing Processes
Type
article
Field-Weighted Citation Impact
0.71

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article

Consistent glass transition temperature of epoxy resin by three different test methods on the same nanomechanical test instrument

Qinqin Fu, Chao Ma, Yuanbin Qin, Xiaohua Cheng et al.
1 citations
Discover Polymers.
Epoxy Resin Curing Processes
0.71
article

Consistent glass transition temperature of epoxy resin by three different test methods on the same nanomechanical test instrument

Qinqin Fu, Chao Ma, Yuanbin Qin, Xiaohua Cheng, Zhen Wang, Pengcheng Zhang
article en
1 citations

Abstract

Glass transition temperature (Tg) is a critical property of polymers that determines their service temperature. Various methods, such as differential thermal analysis (DTA), thermomechanical analysis (TMA), dynamic mechanical analysis (DMA), and thermal dilation analysis (TDA), are commonly used to measure Tg. Large discrepancies often arise due to differences in test conditions, sample sizes, Tg definition, and temperature calibration errors. These inconsistencies make it difficult for researchers to compare results and communicate effectively. To address this issue, an innovative approach by performing TDA, DMA, and TMA on the same nanomechanical test instrument was introduced. This approach measures the Tg of epoxy resin at microscale, eliminating errors from inter-instrument temperature discrepancies. Our results demonstrate that the Tg values obtained by different methods are practically the same when appropriate Tg definition, effective sample size and test conditions are applied. This approach will have a significant impact on polymer research.

Discover Polymers.Vol. 2(1)
University of Science and Technology of China (CN), Hunan University (CN), Xi'an Jiaotong University (CN)
Natural Science Basic Research Program of Shaanxi Province
Affordable and clean energy
Openalex Percentile: Top 29%
Epoxy Resin Curing Processes
0.71
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