Fabrication and analysis of epoxy composites with sunflower seed husk fillers: A grey relational approach
This study focuses on the fabrication and characterization of sunflower seed husk filler (SSHF) - reinforced epoxy composites using the compression molding technique. SSHF particles were added as fillers to the epoxy matrix in varying volumes, namely, 5%, 10%, 15%, and 20%, with two distinct particle size ranges 4-53 µm and 79-463 µm. The mechanical properties of the composites were tested according to the ASTM standards, including flexural, tensile, impact, compression, and hardness tests. Scanning Electron Microscopy (SEM) was used to evaluate the microstructure of the composites, and Grey Relational Analysis (GRA) was employed to optimize the composite performance. The results revealed that the mechanical properties were significantly influenced by SSHF particle size and volume fraction. Smaller SSHF particles (4-53 µm) at 15% filler content (Sample S8) exhibited the highest mechanical strength, achieving a Grey Relational Grade (GRG) of 0.428. SEM analysis confirmed the improved filler dispersion and interfacial bonding, which contributed to the enhanced mechanical performance. These findings underscore the dual benefits of SSHF-epoxy composites: superior mechanical properties and sustainability through agricultural waste utilization. This study demonstrates the potential of SSHF as an eco-friendly reinforcement for epoxy-based materials, paving the way for sustainable composite development for construction and automotive industries.
Authors
- M. Gnanasekaran (ORCID: https://orcid.org/0000-0002-4848-9728)
- Nagappan Ramaswamy (ORCID: https://orcid.org/0000-0002-3430-2758)
- P. Kannan (ORCID: https://orcid.org/0000-0002-3971-4209)
- Balaguru Parasuraman
Institutions
- National Institute of Technology Tiruchirappalli (IN)
- Annamalai University (IN)
Publication Details
- Journal
- Multidisciplinary Science Journal
- Published
- 2025-07-12
- DOI
- https://doi.org/10.31893/multiscience.2026099
- Citations
- 1
- Primary Topic
- Epoxy Resin Curing Processes
- Type
- article
- Field-Weighted Citation Impact
- 0.71