Structural Design Strategies for Thermally Conductive and Electromagnetic Interference Shielding Nanocomposites

The development of thermally conductive and electromagnetic interference (EMI) shielding nanocomposites is becoming increasingly critical for next-generation electronic devices, where effective heat dissipation and high signal integrity are essential. This report summarizes a talk by Professor Sung-Ryong Kim from the Korea National University of Transportation, emphasizing structural design strategies—such as layered architectures, segregated structures, three-dimensional (3D) interconnected networks, and stretching-induced alignment—to enhance both thermal conductivity and EMI shielding effectiveness in polymer-based nanocomposites. By integrating nanofillers such as graphene fluoride (GF), MXene, and carbon nanotubes, Professor Kim’s work highlights how rational structural design can yield ultrathin films with thermal conductivity values up to 210 W/m·K and EMI shielding effectiveness (SE) reaching 62 dB under optimal filler contents. The strategies address not only GHz and THz frequency shielding demands but also practical industry concerns like cost, scalability, and mechanical robustness. Reflecting on potential future directions, Professor Kim underscored the promise of integrating artificial intelligence (AI) to expedite predictive material optimization, and he expressed enthusiasm for collaborating with computational scientists to guide advanced composites research. This convergence of data-driven modeling, sustainable polymer matrices, and industrial manufacturing constraints points the way to commercializable, high-performance thermoconductive EMI shielding solutions.