Review of the effect and progress in uniform films prepared by the magnetron sputtering method

This highlight reviews the latest advances in the preparation of uniform films through magnetron sputtering. It provides a detailed discussion on the effects, characterizations, influence factors and optimization of film thickness and uniformity.

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Publication Details

Journal
CrystEngComm
Published
2025-01-01
DOI
https://doi.org/10.1039/d5ce00515a
Citations
1
Primary Topic
Copper Interconnects and Reliability
Type
article
Field-Weighted Citation Impact
0.43
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Review of the effect and progress in uniform films prepared by the magnetron sputtering method

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CrystEngComm
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Review of the effect and progress in uniform films prepared by the magnetron sputtering method

Aobo Wang, Xinguo Ma, Zhengwang Cheng, Mei Wang, Bin Zhao, Wei Zou, Xinhang Wang, Jun Gao
article en
1 citations

Abstract

This highlight reviews the latest advances in the preparation of uniform films through magnetron sputtering. It provides a detailed discussion on the effects, characterizations, influence factors and optimization of film thickness and uniformity.

CrystEngCommVol. 27(36)
Hubei University of Technology (CN)
Openalex Percentile: Top 39%
Copper Interconnects and Reliability
0.43
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