Multiscale simulation study on the mechanical, electrical, and thermal properties of ZnSb semiconductor
This study presents a comprehensive investigation of the multifunctional properties of ZnSb semiconductors through integrated multiscale simulations.
Authors
- Hui Yang (ORCID: https://orcid.org/0000-0002-7726-3496)
- Shihui Chen (ORCID: https://orcid.org/0000-0003-2122-3791)
- Jianping Lin (ORCID: https://orcid.org/0000-0001-5983-3662)
- Zipei Zhang (ORCID: https://orcid.org/0000-0002-7955-7877)
- Zhishen Wu (ORCID: https://orcid.org/0000-0003-0200-1296)
- Guang Yang (ORCID: https://orcid.org/0000-0002-4824-9994)
- Minghui Cheng (ORCID: https://orcid.org/0000-0001-8135-2443)
Institutions
- Xiamen University of Technology (CN)
Publication Details
- Journal
- Journal of Materials Chemistry C
- Published
- 2025-01-01
- DOI
- https://doi.org/10.1039/d5tc01764e
- Primary Topic
- Advanced Thermoelectric Materials and Devices
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- National Natural Science Foundation of China
- Natural Science Foundation of Fujian Province