Investigation of Stress and Delamination Behaviors of a Bonded Beam Having Orthotropic Inclusion in Adhesive Layer under Tensile Loading

In this paper, the stress behaviors of the single lap joint having orthotropic inclusion in the adhesive layer under tensile load were analyzed. In these analyses, a more realistic approach was taken by considering the heterogeneous nature of the adhesive layer. In the study, there are three different orthotropic inclusion materials in the adhesive layers of the connections: glass-epoxy, graphite-epoxy and boron-epoxy. The effects of the selected inclusion material on the stresses in the connections were analyzed using the finite element method. When single lap connections are examined in terms of material, the stresses have the highest value for boron-epoxy inclusion and the lowest value for glass-epoxy inclusion Additionally, the effect of both the adherend material and the thickness of the inclusion material on the stresses was examined. According to this, in single lap connections, the highest peeling, shear and von-Mises stress values were observed on the adhesive layer when the t o /t i value was 0.5. The possibility of delamination near the inclusion area has been taken into account.