Study on the Application and Reliability of High-k HfO<sub>2</sub>/ZrO<sub>2</sub> Superlattice Dielectrics in Ge Stacked Nanosheet GAAFET at 4K Ultra-Low Temperature

This study explores the potential application of HfO<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf>/ZrO<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf> superlattice (SL-HZO) in cryogenic CMOS technology. We fabricated HfO<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf>/ZO<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf> with a thickness of 0.3nm per layer, and compared to conventional solid-solution Hf<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.5</inf>Zr<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.</inf><inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">5</inf> O<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf>(HZO) thin films, SL-HZO with mixed ferroelectric-antiferroelectric phases exhibited a high dielectric constant, stable capacitance, and excellent reliability. Furthermore, after integrating this 0.3nm SL-HZO material into germanium nanosheet gate-all-around field-effect transistors (Ge NS-GAAFET), cryogenic tests at 4K achieved a subthreshold swing of 28.7 mV/dec, an <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\mathbf{I}_{\mathbf{on}}/\mathbf{I}_{\mathbf{off}}$</tex> ratio of <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$2.22 \times 10^{8}$</tex>, and a drain-induced barrier lowering (DIBL) of 8mV/V, demonstrating outstanding electrical performance. The results indicate that 0.3 nm SL-HZO holds significant potential for future high-performance computing applications (HPC).

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Published
2025-06-08
DOI
https://doi.org/10.23919/snw65111.2025.11097215
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1
Primary Topic
Ferroelectric and Negative Capacitance Devices
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article

Study on the Application and Reliability of High-k HfO2/ZrO2 Superlattice Dielectrics in Ge Stacked Nanosheet GAAFET at 4K Ultra-Low Temperature

Fu-Ju Hou, Guang-Li Luo, Yi-Wen Lin, Yung‐Chun Wu et al.
1 citations
Ferroelectric and Negative Capacitance Devices
0.73
article

Study on the Application and Reliability of High-k HfO2/ZrO2 Superlattice Dielectrics in Ge Stacked Nanosheet GAAFET at 4K Ultra-Low Temperature

Fu-Ju Hou, Guang-Li Luo, Yi-Wen Lin, Yung‐Chun Wu, Chen-You Wei, Kaiwei Huang, T.H. Kao
article en
1 citations

Abstract

This study explores the potential application of HfO<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf>/ZrO<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf> superlattice (SL-HZO) in cryogenic CMOS technology. We fabricated HfO<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf>/ZO<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf> with a thickness of 0.3nm per layer, and compared to conventional solid-solution Hf<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.5</inf>Zr<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.</inf><inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">5</inf> O<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf>(HZO) thin films, SL-HZO with mixed ferroelectric-antiferroelectric phases exhibited a high dielectric constant, stable capacitance, and excellent reliability. Furthermore, after integrating this 0.3nm SL-HZO material into germanium nanosheet gate-all-around field-effect transistors (Ge NS-GAAFET), cryogenic tests at 4K achieved a subthreshold swing of 28.7 mV/dec, an <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\mathbf{I}_{\mathbf{on}}/\mathbf{I}_{\mathbf{off}}$</tex> ratio of <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$2.22 \times 10^{8}$</tex>, and a drain-induced barrier lowering (DIBL) of 8mV/V, demonstrating outstanding electrical performance. The results indicate that 0.3 nm SL-HZO holds significant potential for future high-performance computing applications (HPC).

Texas A&M University System (US), National Tsing Hua University (TW), Taiwan Semiconductor Manufacturing Company (Taiwan) (TW)
Affordable and clean energy
Openalex Percentile: Top 25%
Ferroelectric and Negative Capacitance Devices
0.73
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