Phosphorus Incorporation and Ionization in Ultra-Thin Silicon Films
Experimental results on ex-situ doping of ultra-thin silicon-on-insulator (SOI) substrates with device layer thickness <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$(\mathbf{H}_{\text{SOI}})$</tex> ranging from 8 to 30 nm are presented. This work provides fundamental information regarding doping at the nanoscale and demonstrates that proper surface passivation is crucial for controlling the electrical properties of ultra-thin Si films, resulting in a modulation of dopant ionization and carrier mobility in the conductive channel.
Authors
- M. Fanciulli (ORCID: https://orcid.org/0000-0003-2951-0859)
- Gabriele Seguini (ORCID: https://orcid.org/0000-0002-7729-6212)
- Michele Perego (ORCID: https://orcid.org/0000-0001-7431-1969)
- Andrea Pulici (ORCID: https://orcid.org/0009-0008-6392-8451)
Institutions
- Semiconductor Manufacturing International (Italy) (IT)
- University of Milano-Bicocca (IT)
Publication Details
- Published
- 2025-06-08
- DOI
- https://doi.org/10.23919/snw65111.2025.11097208
- Primary Topic
- Semiconductor materials and devices
- Type
- article
- Field-Weighted Citation Impact
- 0.00