Phosphorus Incorporation and Ionization in Ultra-Thin Silicon Films

Experimental results on ex-situ doping of ultra-thin silicon-on-insulator (SOI) substrates with device layer thickness <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$(\mathbf{H}_{\text{SOI}})$</tex> ranging from 8 to 30 nm are presented. This work provides fundamental information regarding doping at the nanoscale and demonstrates that proper surface passivation is crucial for controlling the electrical properties of ultra-thin Si films, resulting in a modulation of dopant ionization and carrier mobility in the conductive channel.

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Publication Details

Published
2025-06-08
DOI
https://doi.org/10.23919/snw65111.2025.11097208
Primary Topic
Semiconductor materials and devices
Type
article
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article

Phosphorus Incorporation and Ionization in Ultra-Thin Silicon Films

M. Fanciulli, Gabriele Seguini, Michele Perego, Andrea Pulici
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Semiconductor materials and devices
article

Phosphorus Incorporation and Ionization in Ultra-Thin Silicon Films

M. Fanciulli, Gabriele Seguini, Michele Perego, Andrea Pulici
article en

Abstract

Experimental results on ex-situ doping of ultra-thin silicon-on-insulator (SOI) substrates with device layer thickness <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$(\mathbf{H}_{\text{SOI}})$</tex> ranging from 8 to 30 nm are presented. This work provides fundamental information regarding doping at the nanoscale and demonstrates that proper surface passivation is crucial for controlling the electrical properties of ultra-thin Si films, resulting in a modulation of dopant ionization and carrier mobility in the conductive channel.

Semiconductor Manufacturing International (Italy) (IT), University of Milano-Bicocca (IT)
Openalex Percentile: Top 83%
Semiconductor materials and devices
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