High-Frequency Structure Analysis of Semiconductor Pulsed Laser Assembly
The author develops a systematic approach to analyze high-frequency characteristics of semiconductor pulsed laser assembly and presents the results on an industry standard TO package. The method can be used to quantify the performance of any existing or new design of pulsed laser products. The data from high-frequency electrical analysis can be used for electro-thermal simulation and predict high-frequency thermal characteristics.
Authors
- Sam Zhang (ORCID: https://orcid.org/0000-0002-0716-1910)
Publication Details
- Published
- 2025-05-20
- DOI
- https://doi.org/10.1109/pn66844.2025.11097135
- Primary Topic
- Semiconductor Lasers and Optical Devices
- Type
- article
- Field-Weighted Citation Impact
- 0.00