Development of organic pressure-sensitive adhesive under the background of artificial intelligence

Silicone pressure-sensitive adhesives (SiPSAs) have demonstrated broad application potential in electronics and other fields due to their exceptional properties, such as temperature resistance, weather resistance, and chemical corrosion resistance. However, traditional SiPSAs are predominantly thermally cured solvent-based products, which not only exhibit slow curing rates but also release harmful solvents like toluene during application, causing environmental pollution. To address this issue, this study Under the background of artificial intelligence. synthesized thiol-functionalized MTQ silicone resins (MTQ-SH) with various M/(T+Q) ratios using γ-mercaptopropyltrimethoxysilane, tetraethyl orthosilicate, and hexamethyldisiloxane as raw materials. These resins were then photo-crosslinked with vinyl-terminated silicone oil to prepare UV-curable silicone PSAs (UV-SiPSAs). The results revealed that the optimal precursor ratio for UV-SiPSA preparation was M/T/Q = 1.00/0.21/1.58. When the photoinitiator TPO-L was added at 1 wt.% and the molar ratio of thiol groups to vinyl end groups was 1.2:1, the resulting UV-SiPSA exhibited an initial adhesion strength capable of holding a 22# steel ball and a holding time of 230 minutes at 25℃. This UV-curable PSA shows promising potential for replacing traditional thermally cured silicone PSAs in the protective film industry.