Transient electro-thermal technique for measuring the thermal diffusivity/conductivity of 1D/2D materials: from mm down to atomic scale thickness

With the continuous miniaturization of micro-devices and the rapid advancement of novel nanomaterials, thermal characterization techniques tailored for two-dimensional (2D) structures (films and coatings) and one-dimensional (1D) architectures (wires and fibers) have become essential for elucidating structure-property relationships and optimizing material performance. This review provides an in-depth analysis of the Transient Electro-Thermal (TET) technique, a recently developed method for measuring the thermal diffusivity and conductivity of 1D and 2D materials, including dielectric, metallic, and semiconductive films, coatings, and wires/fibers. We discuss the fundamental principles of TET operation, the associated physical and mathematical models for data reduction, and critical methodologies for data fitting, uncertainty analysis, and stray heat transfer mitigation to ensure high repeatability and accuracy. In addition, the latest developments and applications of TET are highlighted, including its extension to atomic-scale thickness, in-situ dynamic thermal property measurements during structural evolution, and the zero-temperature-rise limit method. The outstanding agreement (within ~0.6%) between the measured and reference thermal diffusivity of a Pt wire, validated through extensive experiments and zero-temperature-rise extrapolation, demonstrates the robustness and reliability of the TET technique. Owing to its simplicity in principles, experimental implementation, and data analysis, TET offers significant advantages in uncertainty control, measurement accuracy, and throughput.