Microstructure Regulation of Heat Transfer at Solid-solid Interfaces with Lower Stress for Electronic Devices Cooling

Interfaces in electronic chip packaging have significant resistance for heat dissipation. The small contact area and uneven distribution of thermal interface materials at the interface may both lead to thermal failure of the device. To increase the contact area of the interface, the surfaces with geometric structure are introduced, which is beneficial for the dispersion of thermal interface material simultaneously. This study focuses on the contact interface between the solid and solid, thus three types of contract interfaces was compared, distributed as the conventional plane, the vertebral structure and cube structure, respectively. And the interfacial stress under different pressures was studied. The introduction of microstructure reduces the maximum temperature difference of the interface temperature field from 2.8 °C to 0.9 °C, which is about 1/3 of the original value. And the maximum temperature also decreases from the original 42.7 °C to 34.6 °C, thus the hotspot temperature decreases by 8.1 °C. In addition, the interface with vertebral structure also revels the good mechanical properties that are very necessary in electronics. In this interface with microstructures, the vertebral structure simultaneously displays excellent thermal dissipation, appropriate stress and strain characteristics, and it was proved to be a potential structural interface for heat dissipation in the field of electronics.