Designing parylene coating for implantable brain–machine interfaces

Parylene is widely recognized as an effective candidate for encapsulating implantable bioelectronics due to its outstanding chemical stability, conformity and biocompatibility. However, its weak adhesion to inorganic substrates remains a significant challenge. Here, we explored various pre- and post-deposition treatments to enhance adhesion and stability of parylene coating for implantable brain-machine interfaces (BMIs). We utilized 0%, 0.5%, 1%, and 1.5% (v/v) 3-(trimethoxysilyl)propyl-methacrylate as an adhesion promoter for substrate treatment prior to deposition. Deposited samples were subsequently subjected to post-heat treatments at various temperatures. Samples were exposed to an <i>in vitro</i> accelerated aging bath at 87 °C for 7 days to assess their post-implantation durability. Cytotoxicity and <i>in vivo</i> biocompatibility were also investigated to further evaluate biocompatibility and encapsulation efficiency of parylene coatings on commonly used rigid and flexible bioelectronic substrates. The emergence of carboxyl groups in FTIR and chlorine abstraction in EDS analyses, indicated that the as-deposited samples were degraded during aging. The chemical stability of these coatings was improved in heat-treated samples due to their higher crystallinity. Additionally, delamination and microcrack initiation/growth reduced due to post-heat treatments. We found the optimal heat treatment temperature to be 150 °C; any increase beyond this compromised coating quality by increasing delamination and defect formation. Increasing the concentration of adhesion promoter enhanced coating adhesion to the substrates in both as-deposited samples and the ones heat-treated at 150 °C. In contrast, the adhesion strength decreased when heat-treatment was performed at higher temperatures, even when the concentration of adhesion promoter was increased. Numerical analysis was used to assess the effect of parylene coating on the electrical performance of a typical implantable, wirelessly powered model device. The results demonstrated that the presence of the parylene layer not only preserved the wireless coupling between this device and the pickup probe, but also enhanced it. In addition to these favourable physiochemical improvements, parylene also promoted general <i>in vivo</i> brain compatibility and cell viability of the devices. This study revealed the synergistic effects of pre- and post-deposition treatments and systematically optimized adhesion and stability of parylene coatings for implantable BMIs for the first time.

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Publication Details

Journal
RSC Advances
Published
2025-01-01
DOI
https://doi.org/10.1039/d5ra04683a
Citations
1
Primary Topic
Neuroscience and Neural Engineering
Type
article
Field-Weighted Citation Impact
0.91

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Designing parylene coating for implantable brain–machine interfaces

Layla Khalifehzadeh, Ian Baker, Hamed Arami, Seyedamin Hashemi et al.
1 citations
RSC Advances
Neuroscience and Neural Engineering
0.91
article

Designing parylene coating for implantable brain–machine interfaces

Layla Khalifehzadeh, Ian Baker, Hamed Arami, Seyedamin Hashemi, Saman Ebrahimibasabi, Mostafa Sajjadi, Naghmeh Shahraki, Delaram Tamjid Shabestari, Maryam Golshahi, Austin Borchert
article en
1 citations

Abstract

Parylene is widely recognized as an effective candidate for encapsulating implantable bioelectronics due to its outstanding chemical stability, conformity and biocompatibility. However, its weak adhesion to inorganic substrates remains a significant challenge. Here, we explored various pre- and post-deposition treatments to enhance adhesion and stability of parylene coating for implantable brain-machine interfaces (BMIs). We utilized 0%, 0.5%, 1%, and 1.5% (v/v) 3-(trimethoxysilyl)propyl-methacrylate as an adhesion promoter for substrate treatment prior to deposition. Deposited samples were subsequently subjected to post-heat treatments at various temperatures. Samples were exposed to an <i>in vitro</i> accelerated aging bath at 87 °C for 7 days to assess their post-implantation durability. Cytotoxicity and <i>in vivo</i> biocompatibility were also investigated to further evaluate biocompatibility and encapsulation efficiency of parylene coatings on commonly used rigid and flexible bioelectronic substrates. The emergence of carboxyl groups in FTIR and chlorine abstraction in EDS analyses, indicated that the as-deposited samples were degraded during aging. The chemical stability of these coatings was improved in heat-treated samples due to their higher crystallinity. Additionally, delamination and microcrack initiation/growth reduced due to post-heat treatments. We found the optimal heat treatment temperature to be 150 °C; any increase beyond this compromised coating quality by increasing delamination and defect formation. Increasing the concentration of adhesion promoter enhanced coating adhesion to the substrates in both as-deposited samples and the ones heat-treated at 150 °C. In contrast, the adhesion strength decreased when heat-treatment was performed at higher temperatures, even when the concentration of adhesion promoter was increased. Numerical analysis was used to assess the effect of parylene coating on the electrical performance of a typical implantable, wirelessly powered model device. The results demonstrated that the presence of the parylene layer not only preserved the wireless coupling between this device and the pickup probe, but also enhanced it. In addition to these favourable physiochemical improvements, parylene also promoted general <i>in vivo</i> brain compatibility and cell viability of the devices. This study revealed the synergistic effects of pre- and post-deposition treatments and systematically optimized adhesion and stability of parylene coatings for implantable BMIs for the first time.

RSC AdvancesVol. 15(33)
Arizona State University (US)
Arizona State University, National Institutes of Health, Eyring Materials Center, Arizona State University, National Cancer Institute, National Institute of Biomedical Imaging and Bioengineering, Division of Electrical, Communications and Cyber Systems
Openalex Percentile: Top 24%
Neuroscience and Neural Engineering
0.91
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