Temperature Compensation Method for Eddy Current Displacement Sensor Based on Multiarray Element Fusion

Temperature mismatch between the chip surface and the external reference limits the use of conventional differential temperature compensation techniques for chip-radiator gap measurements in the chip industry. The temperature and gap read by the external reference probe are not correlated with those read by the sensing probe. Therefore, the differential fails. In this paper, a flexible vortex film array is proposed to be embedded in the gap to measure the gap, and temperature compensation is achieved by element fusion. Firstly, the linear independent properties of the sensing of each element are constructed by element parameter design, which improves the element sensing dimension. Secondly, the effect of temperature on gap measurements can be deconstructed by multi-array element fusion. Finally, an experiment involving temperature compensation was carried out over a large range (6.5 mm to 10.4 mm) to achieve good robustness. The results showed a significant reduction in error, with a root mean square error (RMSE) of 5.8 μm in the real chip gap range of 800 μm. Therefore, the full-scale error of 0.73% has been obtained.