High-Reliability Design Based on Bit-Level Repair Techniques

Traditional memory technologies are gradually difficult to meet the demands of high-reliability applications such as automotive electronics and aerospace systems. Spin-transfer torque magnetic random-access memory (STT-MRAM) has emerged as a promising alternative due to its fast read/write speed, high endurance, and full compatibility with CMOS processes. However, the unique physical properties of STT-MRAM pose challenges including hard errors (e.g., shorts) and various types of soft errors. To address these issues, this paper proposes a high-reliability design based on bit-level repair, allowing defective bits to be repaired through dedicated conversion circuits. This approach supports both hard errors repair prior to chip fabrication and real-time repair during the product's operational lifetime,With minimal redundancy and low design complexity, the proposed method significantly improves device endurance and yield.

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Publication Details

Journal
Theory and Practice of Science and Technology
Published
2025-01-01
DOI
https://doi.org/10.47297/taposatwsp2633-456919.20250605
Primary Topic
Semiconductor materials and devices
Type
article
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article

High-Reliability Design Based on Bit-Level Repair Techniques

Ao Shen, Yaxing Zhou
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Theory and Practice of Science and Technology
Semiconductor materials and devices
article

High-Reliability Design Based on Bit-Level Repair Techniques

Ao Shen, Yaxing Zhou
article en

Abstract

Traditional memory technologies are gradually difficult to meet the demands of high-reliability applications such as automotive electronics and aerospace systems. Spin-transfer torque magnetic random-access memory (STT-MRAM) has emerged as a promising alternative due to its fast read/write speed, high endurance, and full compatibility with CMOS processes. However, the unique physical properties of STT-MRAM pose challenges including hard errors (e.g., shorts) and various types of soft errors. To address these issues, this paper proposes a high-reliability design based on bit-level repair, allowing defective bits to be repaired through dedicated conversion circuits. This approach supports both hard errors repair prior to chip fabrication and real-time repair during the product's operational lifetime,With minimal redundancy and low design complexity, the proposed method significantly improves device endurance and yield.

Theory and Practice of Science and TechnologyVol. 6(5)
Zhejiang Medicine (China) (CN)
Industry, innovation and infrastructure
Openalex Percentile: Top 83%
Semiconductor materials and devices
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