Nanoscale Resist-Pattern Defects Clustered in the Micron Region Found by Soft X-ray Microscopy

The causes of pattern defects are diverse, and it is difficult to find their causes immediately, thus further information collection is necessary. Therefore, we attempted to determine the causes of pattern defects by observing pattern defects in the resist pattern state. In this study, resist pattern observation was performed using both soft X-ray microscope and atomic force microscope. The soft X-ray microscope was a microscope with reflective-magnification-projection optics. The photon-energy band was 280-300 eV near the carbon K absorption edge. Contrast images corresponding to the chemical-bonding state of carbon were obtained in this energy band region. Pattern defects were successfully detected from the contrast image. The surface topography was observed by atomic force microscopy. The defects were found to be nanoscale resist-pattern defects clustered in the micron region. The results of the resist observation were then comprehensively discussed to estimate the defect-generation process. The results provided suggestive information for the defect reduction.

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Publication Details

Journal
Journal of Photopolymer Science and Technology
Published
2025-06-24
DOI
https://doi.org/10.2494/photopolymer.38.145
Primary Topic
Advancements in Photolithography Techniques
Type
article
Field-Weighted Citation Impact
0.00

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article

Nanoscale Resist-Pattern Defects Clustered in the Micron Region Found by Soft X-ray Microscopy

Shinji Yamakawa, Tetsuo Harada, Takeo Watanabe, Shuhei Iguchi et al.
Journal of Photopolymer Science and Technology
Advancements in Photolithography Techniques
article

Nanoscale Resist-Pattern Defects Clustered in the Micron Region Found by Soft X-ray Microscopy

Shinji Yamakawa, Tetsuo Harada, Takeo Watanabe, Shuhei Iguchi, Takeharu Motokawa
article en

Abstract

The causes of pattern defects are diverse, and it is difficult to find their causes immediately, thus further information collection is necessary. Therefore, we attempted to determine the causes of pattern defects by observing pattern defects in the resist pattern state. In this study, resist pattern observation was performed using both soft X-ray microscope and atomic force microscope. The soft X-ray microscope was a microscope with reflective-magnification-projection optics. The photon-energy band was 280-300 eV near the carbon K absorption edge. Contrast images corresponding to the chemical-bonding state of carbon were obtained in this energy band region. Pattern defects were successfully detected from the contrast image. The surface topography was observed by atomic force microscopy. The defects were found to be nanoscale resist-pattern defects clustered in the micron region. The results of the resist observation were then comprehensively discussed to estimate the defect-generation process. The results provided suggestive information for the defect reduction.

Journal of Photopolymer Science and TechnologyVol. 38(2)
University of Hyogo (JP)
Ministry of Education, Culture, Sports, Science and Technology
Openalex Percentile: Top 83%
Advancements in Photolithography Techniques
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