Inter/Intra-Chip Optical Wireless Communication with Robust Plasmonic Nanoantenna Design

This research aims to improve antenna efficiency in inter/intra-chip optical wireless communication by utilizing plasmonic materials.The proposed model uses an AgSi ground plane with a silver-coated silicon cube, which mitigates interband transition, while enhancing plasmonic resonance.A planar plasmonic substrate with atomic MoS 2 on a silver surface acts as a barrier against unwanted molecule infiltration, preventing interband transition.A novel bi-rhombic hybrid nanostrip waveguide is introduced, featuring two parallel rhombic layers with a hybrid Ag-silicon ribbon material to mitigate ohmic losses and enhance propagation.The rhombic configuration reduces ohmic losses and optimally amplifies light intensity.The antenna performance is simulated and evaluated using ANSYS HFSS 2019 R3 software, revealing superior performance compared to conventional models, validating its efficacy in inter/intra-chip optical wireless communication applications.