An Investigation of the Surface-Regulating Mechanism of Tungsten Alloys Using the Electrochemical Polishing Process

Tungsten and tungsten alloys are widely used in important industrial fields due to their high density, hardness, melting point, and corrosion resistance. However, machining often leaves processing marks on their surface, significantly affecting the surface quality of precision components in industrial applications. Electrolytic polishing offers high efficiency, low workpiece wear, and simple processing. In this study, an electrolytic polishing method is adopted and a novel trisodium phosphate–sodium hydroxide electrolytic polishing electrolyte is developed to study the effects of temperature, voltage, polishing time, and solution composition on the surface roughness of a tungsten–nickel–iron alloy. The optimal voltage, temperature, and polishing time are determined to be 15 V, 55 °C, and 35 s, respectively, when the concentrations of trisodium phosphate and sodium hydroxide are 100 g·L−1 and 6 g·L−1. In addition, glycerol is introduced into the electrolyte as an additive. The calculated LUMO value of glycerol is −5.90 eV and the HOMO value is 0.40 eV. Moreover, electron enrichment in the hydroxyl region of glycerol can form an adsorption layer on the surface of the tungsten alloy, inhibit the formation of micro-pits, balance ion diffusion, and thus promote the formation of a smooth surface. At 100 mL·L−1 of glycerol, the roughness of the tungsten–nickel–iron alloy decreases significantly from 1.134 μm to 0.582 μm. The electrochemical polishing mechanism of the tungsten alloy in a trisodium phosphate electrolyte is further investigated and explained according to viscous film theory. This study demonstrates that the trisodium phosphate–sodium hydroxide–glycerol electrolyte is suitable for electropolishing tungsten–nickel–iron alloys. Overall, the results support the application of tungsten–nickel–iron alloy in the electronics, medical, and atomic energy industries.