Process Characterization and Interfacial Bonding Effectiveness Assessment of Ultrasonically Assisted Hybrid Composite Overmolding
ABSTRACT This study develops an ultrasonic‐assisted injection overmolding (UAIO) strategy for manufacturing thermoplastic hybrid composites with optimized interfacial properties at reduced processing temperatures of laminates. The proposed method can prepare high‐strength samples at a lower temperature and effectively solve the problem of imbalance between the connection strength and the strength of the continuous fiber laminate in the integral molding process. Experimental results demonstrate ultrasonic energy modulation combines high‐frequency mechanical excitation with localized thermal activation. The data shows ultrasonic enhancement at 900 W increased bonding strength by 56.4% and bonding effectiveness by 11.8% versus the overmolding situation without the action of ultrasound, while mitigating laminate strength degradation caused by secondary heating. This UAIO methodology emphasizes secondary heating optimization of laminates, providing critical insights into the integrated manufacturing of composite components with coordinated material–structure–function characteristics.
Authors
- Ziqing Yu
- Rao Fu (ORCID: https://orcid.org/0000-0002-1907-5833)
- Danyang Zhao (ORCID: https://orcid.org/0000-0002-5548-3367)
- Ankun Xie (ORCID: https://orcid.org/0009-0008-3319-7715)
- Siqi Yan (ORCID: https://orcid.org/0000-0002-5905-3006)
- Ying Liu (ORCID: https://orcid.org/0000-0001-7076-352X)
- Fuji Wang (ORCID: https://orcid.org/0000-0001-6963-4544)
- C. Q. Feng
- Sai Ma (ORCID: https://orcid.org/0009-0003-5366-1144)
Institutions
- Dalian University of Technology (CN)
Publication Details
- Journal
- Polymer Composites
- Published
- 2025-07-24
- DOI
- https://doi.org/10.1002/pc.70132
- Citations
- 2
- Primary Topic
- Mechanical Behavior of Composites
- Type
- article
- Field-Weighted Citation Impact
- 1.73
Funders
- National Natural Science Foundation of China
- National Key Research and Development Program of China
- Fundamental Research Funds for the Central Universities