Implementation of the Close Loop Print Control System to Reduce Defects in the SMT Process in an Electronic Board Production Factory in the Manaus Industrial Pole

This paper explores improvements in quality assurance for Surface Mount Technology (SMT) processes, focusing on the critical stage of solder paste printing. In the context of increasing miniaturization and complexity of electronic devices, ensuring the quality of solder deposition is paramount to prevent defects that compromise final product reliability. This research investigates the most recurrent quality issues in SMT solder paste deposition and proposes a robust solution through the implementation of a Close Loop Print Control system. The study was conducted as a case study in one electronics manufacturing plant, employing a qualitative and exploratory approach. Data was collected through direct observation, document analysis, and interviews with production line staff. The implemented system, integrated with Solder Paste Inspection (SPI) technology, enabled real-time monitoring and automated process adjustments. The results demonstrate a significant reduction in key defects, such as Solder Bridge (43% reduction) and Solder Insufficiency (38% reduction), validating the effectiveness of closed-loop control as a strategic tool for quality improvement. The paper concludes that integrating automated control systems, aligned with Industry 4.0 principles, provides a substantial enhancement to quality assurance, leading to increased efficiency, reduced rework, and higher process reliability in electronics manufacturing.