Study on the retention characteristics of HZO FeFETs

This paper investigates the retention characteristics of Hf<sub>0.5</sub>Zr<sub>0.5</sub>O<sub>2</sub>(HZO) ferroelectric field-effect transistors (FeFETs). FeFETs exhibit prominent advantages such as fast read/write speeds, excellent retention characteristics, and low operational power consumption. However, there is limited research on their retention characteristics at high temperatures, which is a critical factor for enhancing their reliability in practical applications. By utilizing a vacuum probe device and a temperature control system, we altered the environmental temperature and conducted long-term testing on the retention characteristics of the transistors. We obtained the variation in retention characteristics of HZO FeFETs at 300K,365K and 395K, and extrapolated their memory window after 10 years. By characterizing the changes in gate leakage current with temperature, we identified the primary mechanism behind retention degradation. Our research contributes to further improving the retention characteristics of HZO FeFETs.

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Publication Details

Published
2025-07-24
DOI
https://doi.org/10.1117/12.3068895
Primary Topic
Ferroelectric and Negative Capacitance Devices
Type
article
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Study on the retention characteristics of HZO FeFETs

Chongling Hu, Miaomiao Xu, C. F. Xu, Jingyi Hu et al.
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Ferroelectric and Negative Capacitance Devices
article

Study on the retention characteristics of HZO FeFETs

Chongling Hu, Miaomiao Xu, C. F. Xu, Jingyi Hu, Hui Zhu, WenXuan Zheng
article en

Abstract

This paper investigates the retention characteristics of Hf<sub>0.5</sub>Zr<sub>0.5</sub>O<sub>2</sub>(HZO) ferroelectric field-effect transistors (FeFETs). FeFETs exhibit prominent advantages such as fast read/write speeds, excellent retention characteristics, and low operational power consumption. However, there is limited research on their retention characteristics at high temperatures, which is a critical factor for enhancing their reliability in practical applications. By utilizing a vacuum probe device and a temperature control system, we altered the environmental temperature and conducted long-term testing on the retention characteristics of the transistors. We obtained the variation in retention characteristics of HZO FeFETs at 300K,365K and 395K, and extrapolated their memory window after 10 years. By characterizing the changes in gate leakage current with temperature, we identified the primary mechanism behind retention degradation. Our research contributes to further improving the retention characteristics of HZO FeFETs.

Beijing University of Technology (CN)
Openalex Percentile: Top 84%
Ferroelectric and Negative Capacitance Devices
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