Explicit Analytical Model of Stretchable Interconnects for Flexible Electronics System

Printed circuit board (PCB) is one of the strong backbones to execute electronic system designs. Owing to fast and reliable communication requirements between integrated circuit (IC) with other peripheral components over PCB, there is a quest for development of board-level designs and layouts. The advancement in technology has led to inventions from conventional rigid to flexible PCBs or flexible electronics (FE). The conformability of FE circuitry majorly depends upon the stretchable interconnects. Interconnect is the medium through which signal is transmitted. The characteristic of stretchable interconnects is determined through their electrical and mechanical properties. The analytical model and parasitic extraction of interconnect for rigid PCB structures have been widely explored earlier. However, the analytical formulation of stretchable interconnect still remains a challenge and meagerly explored till date. Consequently, in this work, explicit analytical model for parasitic extraction of stretchable interconnects <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">viz.</i> resistance (<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">R</i>), inductance (<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">L</i>) and capacitance (<italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">C</i>) under stretching and bending effects have been novely proposed. Five different interconnect materials have been considered for the analysis. The analytical model results have been validated with ANSYS EDA tool. It is investigated that the proposed analytical model results are in very close agreement with the ANSYS results for all the considered cases.