First-principles analysis of structural stability, mechanical anisotropy, and thermophysical and electronic properties of Cu–Pd intermetallic compounds: a comparative study of CuPd, CuPd<sub>3</sub>, Cu<sub>3</sub>Pd, and Cu<sub>4</sub>Pd
Cu 3 Pd offers superior stiffness, thermal stability, and toughness, making it ideal for microelectronic packaging. In contrast, Cu 4 Pd provides greater ductility and thermal compliance for applications with large thermal fluctuations.
Authors
- Ching-Feng Yu (ORCID: https://orcid.org/0000-0002-0662-4901)
- Hsien‐Chie Cheng (ORCID: https://orcid.org/0000-0002-1527-4616)
Institutions
- National United University (TW)
- Feng Chia University (TW)
Publication Details
- Journal
- New Journal of Chemistry
- Published
- 2025-01-01
- DOI
- https://doi.org/10.1039/d5nj02120k
- Citations
- 4
- Primary Topic
- Intermetallics and Advanced Alloy Properties
- Type
- article
- Field-Weighted Citation Impact
- 2.85