Mass transport and grain growth enable high thermoelectric performance in polycrystalline SnS
Grain boundary engineering enables high thermoelectric performance in polycrystalline SnS by synergistically reducing lattice thermal conductivity through mass transport and enhancing carrier mobility via grain growth promotion.
Authors
- Li‐Dong Zhao (ORCID: https://orcid.org/0000-0003-1247-4345)
- Zhanxiang Yin
- Huaping Liang (ORCID: https://orcid.org/0000-0003-4157-445X)
- Xiaojun Li (ORCID: https://orcid.org/0009-0004-0340-4075)
- Heping An
- Tao Hong (ORCID: https://orcid.org/0000-0001-8349-7793)
- Xin Qian (ORCID: https://orcid.org/0000-0001-7016-0147)
- Chongjian Zhou (ORCID: https://orcid.org/0000-0002-2245-3057)
- Meng‐Yu Wu (ORCID: https://orcid.org/0000-0002-8773-1847)
- Yuxin Li (ORCID: https://orcid.org/0000-0001-7851-2637)
- Xiaoqian Wang (ORCID: https://orcid.org/0000-0002-4424-6024)
- Xiao Yu (ORCID: https://orcid.org/0009-0007-9608-2221)
- Wenke He (ORCID: https://orcid.org/0000-0002-9282-8205)
- Lizhong Su
Institutions
- University of Electronic Science and Technology of China (CN)
- Northwestern Polytechnical University (CN)
- Beijing Academy of Artificial Intelligence (CN)
- Hebei University (CN)
- Taiyuan University of Science and Technology (CN)
- Beihang University (CN)
- Ministry of Industry and Information Technology (CN)
Publication Details
- Journal
- Journal of Materials Chemistry A
- Published
- 2025-01-01
- DOI
- https://doi.org/10.1039/d5ta05300e
- Citations
- 1
- Primary Topic
- Advanced Thermoelectric Materials and Devices
- Type
- article
- Field-Weighted Citation Impact
- 0.52
Funders
- National Natural Science Foundation of China
- University of Electronic Science and Technology of China