Validation of Transfer Matrix Method Simulations with Experiment

This chapter validates the accuracy of Transfer Matrix Method (TMM) simulations for designing multilayer thin films by comparing them with experimental measurements. Five multilayer wafers were fabricated via the plasma-enhanced chem- ical vapour deposition (PECVD) method and sputtering techniques with various materials, including aluminum, silica and titanium nitride (TiN). The fabricated wafers were subjected to extensive testing via ellipsometry and scanning electron microscopy to measure the layer thickness, refractive indices, and optical properties. The experimental results closely match those of the TMM simulations, confirming the reliability of this design approach. Wafers with various multilayer configu- rations, including metal‒insulator‒metal (MIM) stacks, have demonstrated controlled absorption characteristics tailored to specific optical requirements. This study supports the use of TMMs for designing multilayer stacks for advanced optical applications, such as selective emitters in thermophotovoltaic systems, validating the approach for further development in optimizing multilayer designs.