Multifunctional Shuttle for Processing Small Diameter and Ultra-Thin Semiconductor Wafers

In a first for Russia, a 100 mm diameter wafer was processed to create holes for TSV structures using automated equipment designed for 150 mm diameter wafers without needing to reconfigure the installations. A shuttle wafer was developed for this purpose. The reliability of the silicon shuttle was determined through experimental studies of the mechanical strength of silicon. The thickness of the ultra-thin Si wafer that can be processed without damage in the shuttle wafer on installations with a vacuum table was calculated based on the data obtained.