Research on the Optimization Design of Thermal Resistance and Pumping Power of Microchannel Heat Sinks (MCHS)

Microchannel heat sinks (MCHS), with their outstanding heat dissipation efficiency and compact structural design, have become a crucial technology to address the thermal management challenges posed by high-power density devices. They are widely applied in fields such as electronic equipment, lasers, aerospace, and new energy, significantly advancing enhanced heat transfer technologies. The fundamental principle lies in utilizing fluid flow within microscale channels to achieve efficient heat exchange and dissipation. Their performance is primarily evaluated based on key indicators such as thermal resistance, pressure drop, and heat transfer coefficient. This paper systematically reviews the working principles of MCHS, core design parameters (such as channel shape and size), and optimization strategies for thermal resistance and pumping power (pressure drop). Methods for enhancing MCHS heat transfer efficiency, including filling channels with porous materials or introducing specific microstructures (such as ribs and cavities), are discussed. The current research status and development trends are analyzed in depth. This study aims to provide theoretical references for the optimized design and application of MCHS and to prospect its future development in high-performance thermal management systems.