Towards robust ultra-low k spin-on dielectric materials

We have incorporated a polymer-bound porogen into an organosiloxane polymer and investigated the impact of the polymerization process on the final material properties. This approach resulted in a promising combination of dielectric properties and a polymerization process that enhances the mechanical properties of the porous dielectric material. In addition, plasma damage was found to be comparable to that of porogen-free spin-on dielectric material, indicating potential compatibility with back-end-of-line integration processes.