A Biomimetic Microchannel Heat Sink for Enhanced Thermal Performance in Chip Cooling

The rapid advancement of artificial intelligence continuously increases the demand for high computing power, leading to substantial rises in chip power consumption and heat generation. As a result, efficient thermal management has become essential. Inspired by the placoid scales on shark skin, we designed a bionic microchannel heat sink by introducing biomimetic structures on the inner channel surfaces to enhance heat dissipation. Numerical simulations are performed to investigate thermal behavior under different structural configurations. The results show that the arrangement, number, and inclination angle of the placoid structures significantly influence heat transfer by modifying flow patterns, enlarging the heat transfer area, and altering the thermal boundary layer. Notably, at a flow velocity of 2 m/s, the cooling performance differs significantly between inclination angles of 0° and 17°. Moreover, the influence of different quantities of placoid structures shows a consistent trend across various flow rates. These findings demonstrate that bionic surface structures can effectively improve the thermal performance of microchannel heat sinks, offering a promising strategy for high-performance chip cooling.