Correlation of the Thermal Conductivity and Mechanical Properties in Hybrid Filler Systems of Thermosets

Thermal management reveals an increasing importance due to the changing demands in terms of the compactness and the performance of electronic devise. Polymers in general and thermosets specifically depict a low thermal conductivity, where filler systems are needed to improve performance and make polymers suitable for certain applications. So far, different influencing factors in terms of improving the thermal conductivity in thermosets, mainly through the use of single-filler systems, have been investigated in. To some extent, hybrid filler systems have been examined as well; however, the behavior itself in terms of the thermal conductivity as well as the mechanical properties is rather unknown. In terms of the applications, it is essential to understand the correlation between the thermal conductivity and the mechanical properties as this is the fundamental requirement to realize a proper dimensioning of samples in applications. Therefore, this paper investigates hybrid filler systems based on boron nitride (BN) and three different second fillers with varying ratios and in terms of both the improvement of the thermal conductivity and the mechanical properties. Copper (Cu) was shown to reach the best compromise within the hybrid materials. Furthermore, criteria of an improved thermal flow path and sufficient mechanical properties have been stated in general.