A Study on the Temperature Characteristics of RC-IGBT

This study investigates the temperature characteristics of Reverse-Conducting IGBTs (RC-IGBTs) to evaluate their reliability and applicability of conventional Temperature-Sensitive Electrical Parameters (TSEPs) for junction temperature monitoring. Through TCAD simulations and experimental double-pulse tests, four key TSEPs were analyzed under varying temperatures (<tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$300 ~\mathrm{K}-425 ~\mathrm{K}$</tex> in simulations, <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$23^{\circ} \mathrm{C}-140^{\circ} \mathrm{C}$</tex> in experiments) and results demonstrated strong linear correlations between TSEPs and temperature. The findings confirm that RC-IGBTs exhibit temperature behaviors similar to traditional IGBTs, validating existing TSEPs for practical thermal monitoring.