An Overview of Gate Oxide Degradation Monitoring Techniques in SiC MOSFETs
Silicon carbide (SiC) MOSFETs have become essential components in high-power and high-temperature applications, thanks to their superior efficiency, switching performance, and thermal conductivity compared to traditional silicon devices. However, gate oxide degradation presents a significant challenge to their long-term reliability. This review explores the underlying mechanisms of gate oxide degradation, temperature-sensitive electrical parameters (TSEPs) for monitoring, and practical approaches to detect and mitigate degradation effects. A synthesis of recent research and advancements provides insight into future directions for improving SiC MOSFET reliability and operational lifespan.
Authors
- Mohammad Vedadi
- Philipp Rehlaender (ORCID: https://orcid.org/0000-0002-7552-3354)
Institutions
- E.ON (United Kingdom) (GB)
Publication Details
- Published
- 2025-06-11
- DOI
- https://doi.org/10.1109/gpecom65896.2025.11061834
- Primary Topic
- Silicon Carbide Semiconductor Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00