Fixed Particle Size Ratio Pure Copper Metal Powder Molding Fine Simulation Analysis

In this paper, a discrete element method (DEM) coupled with a finite element method (FEM) was used to elucidate the impact of packing structures and size ratios on the cold die compaction behavior of pure copper powders. HCP structure, SC structure, and three random packing structures with different particle size ratios (1:2, 1:3, and 1:4) were generated by the DEM, and then simulated by the FEM to analyze the average relative density, von Mises stress, and force chain structures of the compact. The results show that for HCP and SC structures with a regular stacking structure, the average relative densities of the compact were higher than those of random packing structures, which were 0.9823, 0.9693, 0.9456, 0.9502, and 0.9507, respectively. Compared with their initial packing density, it could be improved by up to 21.13%. For the bigger particle in HCP and SC structures, the stress concentration was located between the adjacent layers, while in the small particles, it was located between contacted particles. During the initial compaction phase, smaller particles tend to occupy the voids between larger particles. As the pressure increases, larger particles deform plastically in a notable way to create a stabilizing force chain. This action reduces the axial stress gradient and improves radial symmetry. The transition from a contact-dominated to a body-stress-dominated state is further demonstrated by stress distribution maps and contact force vector analysis, highlighting the interaction between particle rearrangement and plasticity.