Modelling, Thermal Analysis and Optimization of Phase Change Material based Heat Sink with Oblique Porous Copper Fins.

This research focuses on the modelling, thermal analysis, and optimization of a phase change material (PCM) based heat sink with oblique porous copper fins. The study aims to address the challenge of heat dissipation in high-performance electronic devices by exploring the use of PCM, specifically RT50 and RT60, integrated with oblique porous copper fins. The research employs both 3D and 2D modelling techniques, utilizing ANSYS software for simulation. The 2D simulations, representing different oblique models with varying fin and PCM lengths, are developed to analyze heat transfer through fins and convection on the air surface. The study considers the material properties of PCM, including RT50, RT60, and thermal conductivity enhancers (TCE) such as copper. Meshing, boundary conditions, and natural convection are essential aspects of the methodology. The results of numerical simulations reveal the temperature profile and liquid fraction during the melting and solidification phases for both RT50 and RT60 under adiabatic and natural convection conditions. The findings emphasize the significance of RT60 in expediting melting and solidification phenomena, providing valuable insights for designing efficient PCM-based heat sinks.