Enhancing Thermal Conductivity in Electrospun Polymer Structures for Heat Management Applications

Over the past decade, enhancing the thermal conductivity of polymers has attracted growing attention as an innovative strategy to address the challenges of thermal energy management across diverse sectors. This interest stems not only from the inherent advantages of polymers, such as low weight, flexibility, and ease of processing, but also from their widespread use and established roles in numerous applications. Among available approaches, electrospinning has emerged as a promising method. It offers unique advantages for producing thermally conductive polymer fibers, mats, and yarns, such as enhanced polymer chain alignment, controlled filler distribution, and tunable porosity. Consequently, extensive research has been conducted in this area in recent years. Therefore, this review uniquely focuses on thermally conductive electrospun polymer structures, providing a comprehensive synthesis of advancements in this growing field. It begins with an overview of heat conduction mechanisms in polymers and composites, emphasizing key factors influencing thermal transport. The principles of electrospinning and its advantages for thermal conductivity enhancement are discussed, along with strategies to further improve their thermal performance. Additionally, measurement methods, existing challenges, and recent developments are examined. Finally, the review highlights emerging applications and outlines future research directions to guide continued innovation of high‐performance electrospun polymer materials.