A Bit‐Serial Compute‐Transfer Architecture for High‐Speed Data Processing in Chip‐to‐Chip Systems

ABSTRACT This brief proposes a bit‐serial compute‐transfer architecture tailored for high‐speed data processing across chip‐to‐chip links. Our design merges computation and transmission at the physical layer via a voltage‐mode logic (VML) interface, without intermediate packing or unpacking. In SMIC 0.13 µm CMOS, the architecture achieves 1 Gbps per channel at 1 GHz, delivering 0.625 GOPS to resource‐constrained edge devices. While overall energy efficiency is lower than that of computing‐only designs, the proposed structure excels in area, gate density, and scalability. This compute‐transfer architecture reduces bandwidth bottlenecks and deserialization overhead in multi‐chip systems, offering a modular building block for future neural network accelerators.

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Publication Details

Journal
Electronics Letters
Published
2025-01-01
DOI
https://doi.org/10.1049/ell2.70352
Primary Topic
Interconnection Networks and Systems
Type
article
Field-Weighted Citation Impact
0.00

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A Bit‐Serial Compute‐Transfer Architecture for High‐Speed Data Processing in Chip‐to‐Chip Systems

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A Bit‐Serial Compute‐Transfer Architecture for High‐Speed Data Processing in Chip‐to‐Chip Systems

Ping Li, Siyi Pan, Weiran Ding, Xiaoshu Cheng, Yiwen Wang
article en

Abstract

ABSTRACT This brief proposes a bit‐serial compute‐transfer architecture tailored for high‐speed data processing across chip‐to‐chip links. Our design merges computation and transmission at the physical layer via a voltage‐mode logic (VML) interface, without intermediate packing or unpacking. In SMIC 0.13 µm CMOS, the architecture achieves 1 Gbps per channel at 1 GHz, delivering 0.625 GOPS to resource‐constrained edge devices. While overall energy efficiency is lower than that of computing‐only designs, the proposed structure excels in area, gate density, and scalability. This compute‐transfer architecture reduces bandwidth bottlenecks and deserialization overhead in multi‐chip systems, offering a modular building block for future neural network accelerators.

Electronics LettersVol. 61(1)
University of Electronic Science and Technology of China (CN), National Engineering Research Center of Electromagnetic Radiation Control Materials (CN)
National Key Laboratory of Electronic Thin Films and Integrated Devices
Openalex Percentile: Top 83%
Interconnection Networks and Systems
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