Modeling of thermal distribution on cryosurface for low temperatures

In this work, the temperature distribution on a cryosurface operating at low temperatures (in the range from 300 K to 80 K) was thoroughly studied. This type of cryogenic cooling surface is specifically designed for experimental processes that involve the controlled deposition and subsequent cooling of various inorganic compounds. Such processes are essential for conducting detailed investigations into the physicochemical properties, morphology, and structure of these materials under cryogenic conditions. The temperature distribution was analyzed through numerical simulation, which included modeling the cooling process of the cryopanel surface down to cryogenic temperatures using the finite element method. Liquid nitrogen was selected as the working coolant due to its availability, low boiling point, and high efficiency in achieving the required cooling rate. The simulation results revealed the temperature gradient both within the volume and on the surface of the cryopanel. Additionally, the influence of the thermal conductivity of different structural materials–aluminum and stainless steel–on the cooling efficiency was examined. The desired cryosurface temperature range (80–90 K) was successfully reached within 1800 seconds, using a nitrogen flow through a coiled pipe of 6 mm in diameter. Key words: cryosurface, computer modelling, thermal distribution, low temperatures, thermal conductiv ity.