Application of Artificial Intelligence to Improve Chip Defect Detection Using Semiconductor Equipment

We investigated the application of artificial intelligence (AI) technology for the inspection of semiconductor process equipment to address key issues such as low production efficiency and high equipment failure rates. The semiconductor industry, being central to modern technology, requires complex and precise processes where even minor defects lead to product failures, negatively impacting yield and increasing costs. Traditional inspection methods are not adequate for modern high-precision, high-efficiency production demands. By integrating advanced AI technologies, such as machine learning, deep learning, and pattern recognition, large volumes of experimental data are collected and analyzed to optimize process parameters, enhance stability, and improve product yield. By using AI, the identification and classification of defects are automated to predict potential equipment failures and reduce downtime and overall costs. By combining AI with automated optical inspection (AOI) systems, a widely used defect detection tool has been developed for semiconductor manufacturing. However, under complex conditions, AOI systems are prone to producing false positives, resulting in overkill rates above 20%. This wastes perfect products and increases the cost due to the need for manual re-inspection, hindering production efficiency. This study aims to improve wafer inspection accuracy using AI technology and reduce false alarms and overkill rates. By developing intelligent detection models, the system automatically filters out false defects and minimizes manual intervention, boosting inspection efficiency. We explored how AI is used to analyze inspection data to identify process issues and optimize workflows. The results contribute to the reduction in labor and time costs, improving equipment performance, and significantly benefitting semiconductor production management. The AI-driven method can be applied to other manufacturing processes to enhance efficiency and product quality and support the sustainable growth of the semiconductor industry.

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Publication Details

Published
2025-06-30
DOI
https://doi.org/10.3390/engproc2025098026
Citations
1
Primary Topic
Industrial Vision Systems and Defect Detection
Type
article
Field-Weighted Citation Impact
1.24
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article

Application of Artificial Intelligence to Improve Chip Defect Detection Using Semiconductor Equipment

Chung‐Jen Fu, Han Tseng, Hsuan-Lin Chen
1 citations
Industrial Vision Systems and Defect Detection
1.24
article

Application of Artificial Intelligence to Improve Chip Defect Detection Using Semiconductor Equipment

Chung‐Jen Fu, Han Tseng, Hsuan-Lin Chen
article en
1 citations

Abstract

We investigated the application of artificial intelligence (AI) technology for the inspection of semiconductor process equipment to address key issues such as low production efficiency and high equipment failure rates. The semiconductor industry, being central to modern technology, requires complex and precise processes where even minor defects lead to product failures, negatively impacting yield and increasing costs. Traditional inspection methods are not adequate for modern high-precision, high-efficiency production demands. By integrating advanced AI technologies, such as machine learning, deep learning, and pattern recognition, large volumes of experimental data are collected and analyzed to optimize process parameters, enhance stability, and improve product yield. By using AI, the identification and classification of defects are automated to predict potential equipment failures and reduce downtime and overall costs. By combining AI with automated optical inspection (AOI) systems, a widely used defect detection tool has been developed for semiconductor manufacturing. However, under complex conditions, AOI systems are prone to producing false positives, resulting in overkill rates above 20%. This wastes perfect products and increases the cost due to the need for manual re-inspection, hindering production efficiency. This study aims to improve wafer inspection accuracy using AI technology and reduce false alarms and overkill rates. By developing intelligent detection models, the system automatically filters out false defects and minimizes manual intervention, boosting inspection efficiency. We explored how AI is used to analyze inspection data to identify process issues and optimize workflows. The results contribute to the reduction in labor and time costs, improving equipment performance, and significantly benefitting semiconductor production management. The AI-driven method can be applied to other manufacturing processes to enhance efficiency and product quality and support the sustainable growth of the semiconductor industry.

Chaoyang University of Technology (TW)
Openalex Percentile: Top 18%
Industrial Vision Systems and Defect Detection
1.24
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