Optimizing post-processing procedures to enhance bond quality of additively manufactured aluminum alloy 6061 using multiscale modeling

Abstract Optimizing post-processing procedures, such as hot isostatic pressing (HIP), is crucial for minimizing defects in additively manufactured aluminum alloy 6061 (6061) components. In this study, we introduce a multiscale modeling framework integrating molecular dynamics, mesoscale reaction–diffusion, and finite-element modeling to optimize the HIP process by identifying optimal parameters. Our findings reveal that bonding criteria are primarily determined by the rate of magnesium diffusion and the thickness of the Al 2 O 3 layer, leading to the formation of a complex spinel phase at the interface. The multiscale model highlights temperature as the most significant factor influencing bond quality. With HIP temperatures exceeding 400 °C, bond interface voids collapse completely, resulting in desirable bond characteristics and strength. Below 400 °C, void closure is challenging, with multiple factors contributing to the process. This approach offers comprehensive strategies for post-processing optimization, improving bond quality and cutting experimental costs, thus advancing the performance of AA6061 in high-demand applications.