A 1.8TB/s HBM Heterogeneously Integrated GPU Design Exploring 2.5D Packaging Technology
2.5D packaging supports high-speed data transmission, meeting performance requirements of GPU. However, signal integrity (SI) is a key challenge to packaging. This paper demonstrates a GPU with HBM and adopts 2.5D packaging technology. A series of design schemes are proposed, including 4-marker die-interposer alignment, 5-metal-layer connection with HBM by TSV. Moreover, Cup bump and octagon under bump metallurgy technologies are used in interposer to improve signal transmission quality. The measurement results illustrate these technologies can improve SI effectively, achieve 1.8 TB/s bandwidth in 2.5D packaging.
Authors
- Huazhong Yang (ORCID: https://orcid.org/0000-0003-2421-353X)
- Weiliang Chen (ORCID: https://orcid.org/0000-0003-0304-583X)
- Shuang Wang (ORCID: https://orcid.org/0009-0006-9302-4571)
- Xueqing Li (ORCID: https://orcid.org/0000-0002-8051-3345)
- Jiang Chen (ORCID: https://orcid.org/0009-0000-6888-6643)
Institutions
- Tsinghua University (CN)
Publication Details
- Published
- 2025-03-09
- DOI
- https://doi.org/10.1109/edtm61175.2025.11041033
- Primary Topic
- 3D IC and TSV technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00