Practical Thermal Solution for 1-MVA Three-Level ANPC Inverter in Aerospace Applications

In aerospace applications, high-performance cooling systems are essential to ensure the reliability of power inverters under extreme operating conditions. This paper presents the design and analysis of a practical pin-fin liquid cooling system for a 1 MVA silicon carbide (SiC)-based three-level active neutral point clamped (ANPC) inverter. The thermal and hydraulic performance was evaluated through finite element analysis (FEA) models of SiC power modules and computational fluid dynamics (CFD) simulations, confirming the heat transfer efficiency required for aerospace environments at 70°C coolant temperature. The cooling solution leverages a staggered pin-fin arrangement to improve heat transfer efficiency while maintaining manufacturability and cost-effectiveness. Two different cold plate configurations—series and parallel—were compared for uniform fluid distribution and cost-effectiveness. Special attention was also given to sealing design, ensuring reliability in preventing coolant leakage. The system effectively manages over 7.2 kW power loss, maintaining junction temperature <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T<sub>j</sub></i> safely below the 150°C limit. Experimental tests validated the cooling system’s hydraulic and thermal performance, demonstrating its ability to handle high power losses with low pressure drop, making it a robust and cost-effective solution for high-power aerospace inverters.

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Publication Details

Journal
IEEE Journal of Emerging and Selected Topics in Power Electronics
Published
2025-06-30
DOI
https://doi.org/10.1109/jestpe.2025.3584057
Primary Topic
Silicon Carbide Semiconductor Technologies
Type
article
Field-Weighted Citation Impact
0.00

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article

Practical Thermal Solution for 1-MVA Three-Level ANPC Inverter in Aerospace Applications

Giorgio Pietrini, Di Wang, Linke Zhou, Jiaming An et al.
IEEE Journal of Emerging and Selected Topics in Power Electronics
Silicon Carbide Semiconductor Technologies
article

Practical Thermal Solution for 1-MVA Three-Level ANPC Inverter in Aerospace Applications

Giorgio Pietrini, Di Wang, Linke Zhou, Jiaming An, Piranavan Suntharalingam, Mikhail Goykhman, Ali Emadi, Samuel Hemming, Yulei Wang, Mohamed Hefny
article en

Abstract

In aerospace applications, high-performance cooling systems are essential to ensure the reliability of power inverters under extreme operating conditions. This paper presents the design and analysis of a practical pin-fin liquid cooling system for a 1 MVA silicon carbide (SiC)-based three-level active neutral point clamped (ANPC) inverter. The thermal and hydraulic performance was evaluated through finite element analysis (FEA) models of SiC power modules and computational fluid dynamics (CFD) simulations, confirming the heat transfer efficiency required for aerospace environments at 70°C coolant temperature. The cooling solution leverages a staggered pin-fin arrangement to improve heat transfer efficiency while maintaining manufacturability and cost-effectiveness. Two different cold plate configurations—series and parallel—were compared for uniform fluid distribution and cost-effectiveness. Special attention was also given to sealing design, ensuring reliability in preventing coolant leakage. The system effectively manages over 7.2 kW power loss, maintaining junction temperature <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T<sub>j</sub></i> safely below the 150°C limit. Experimental tests validated the cooling system’s hydraulic and thermal performance, demonstrating its ability to handle high power losses with low pressure drop, making it a robust and cost-effective solution for high-power aerospace inverters.

IEEE Journal of Emerging and Selected Topics in Power ElectronicsVol. 13(4)
Eaton (Taiwan) (TW), Eaton (United States) (US), McMaster University (CA)
Eaton Corporation, Mitacs
Affordable and clean energy
Openalex Percentile: Top 87%
Silicon Carbide Semiconductor Technologies
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