Solder Fatigue Life Prediction Method Considering Intermetallic Compound Growth
This paper presents a method for predicting solder joint life by considering the growth of the intermetallic compound (IMC). The relationship between singlecycle damage and the number of cycles is established by combining fatigue life models with IMC growth equations. The cumulative damage theory is employed to integrate damage over time, enabling a quantitative evaluation of the IMC's impact on solder joint life.
Authors
- Yikang Wang (ORCID: https://orcid.org/0000-0001-6467-5953)
- Can Liu (ORCID: https://orcid.org/0000-0001-5247-963X)
- Yintang Yang (ORCID: https://orcid.org/0000-0002-5974-1546)
- Xiaopeng Wu (ORCID: https://orcid.org/0000-0001-8425-3571)
- Jiahao Hou
Institutions
- Xidian University (CN)
Publication Details
- Published
- 2025-03-09
- DOI
- https://doi.org/10.1109/edtm61175.2025.11040800
- Primary Topic
- Electronic Packaging and Soldering Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00