How Semiconductor Industry New Challenges Will Foster Engineered Substrates?

In this article we present some key ways in which Engineered Substrates will impact the future of the semiconductor industry as well as our daily lives. It already happens to automotive revolutions with wide bandgap materials and vehicle electrification, as well as FDSOI for edge computing and will happen to the new emerging technology breakthrough for advanced CMOS transistors as well as new materials for mobility. Soitec's proprietary Smart Cut™ technology is a versatile platform for combining all types of materials to improve device performance and meet new challenges in the semiconductor industry.

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Publication Details

Published
2025-03-09
DOI
https://doi.org/10.1109/edtm61175.2025.11040710
Primary Topic
3D IC and TSV technologies
Type
article
Field-Weighted Citation Impact
0.00
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article

How Semiconductor Industry New Challenges Will Foster Engineered Substrates?

Christophe Figuet
3D IC and TSV technologies
article

How Semiconductor Industry New Challenges Will Foster Engineered Substrates?

Christophe Figuet
article en

Abstract

In this article we present some key ways in which Engineered Substrates will impact the future of the semiconductor industry as well as our daily lives. It already happens to automotive revolutions with wide bandgap materials and vehicle electrification, as well as FDSOI for edge computing and will happen to the new emerging technology breakthrough for advanced CMOS transistors as well as new materials for mobility. Soitec's proprietary Smart Cut™ technology is a versatile platform for combining all types of materials to improve device performance and meet new challenges in the semiconductor industry.

Soitec (France) (FR)
Industry, innovation and infrastructure
Openalex Percentile: Top 87%
3D IC and TSV technologies
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How Semiconductor Industry New Challenges Will Foster Engineered Substrates? — Christophe Figuet · (2025) | TGRS Research Map | TGRS