How Semiconductor Industry New Challenges Will Foster Engineered Substrates?
In this article we present some key ways in which Engineered Substrates will impact the future of the semiconductor industry as well as our daily lives. It already happens to automotive revolutions with wide bandgap materials and vehicle electrification, as well as FDSOI for edge computing and will happen to the new emerging technology breakthrough for advanced CMOS transistors as well as new materials for mobility. Soitec's proprietary Smart Cut™ technology is a versatile platform for combining all types of materials to improve device performance and meet new challenges in the semiconductor industry.
Authors
- Christophe Figuet
Institutions
- Soitec (France) (FR)
Publication Details
- Published
- 2025-03-09
- DOI
- https://doi.org/10.1109/edtm61175.2025.11040710
- Primary Topic
- 3D IC and TSV technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00