IC Modeling via Machine Learning Regressions: A Data-Driven Approach to SPICE Integration

This paper presents a method for generating accurate and efficient macromodels of high-speed I/O buffers. Extending existing techniques, the proposed approach enables a modular and scalable model generation tool based on machine-learning. Given the limitations of traditional methods, this work leverages kernel regression to develop SPICE-compliant models. Two compression schemes, random selection and Nyström approximation are used and thoroughly compared to reduce the number of expansion terms, with beneficial effects in terms of compactness of the SPICE implementation. The effectiveness of the method in terms of model accuracy and efficiency is stressed through real devices and typical signal and power integrity co-simulations.

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Publication Details

Journal
IEEE Transactions on Components Packaging and Manufacturing Technology
Published
2025-06-30
DOI
https://doi.org/10.1109/tcpmt.2025.3584470
Primary Topic
VLSI and Analog Circuit Testing
Type
article
Field-Weighted Citation Impact
0.00
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article

IC Modeling via Machine Learning Regressions: A Data-Driven Approach to SPICE Integration

Igor Simone Stievano, Riccardo Trinchero, N. Tanguy, Mihai Telescu et al.
IEEE Transactions on Components Packaging and Manufacturing Technology
VLSI and Analog Circuit Testing
article

IC Modeling via Machine Learning Regressions: A Data-Driven Approach to SPICE Integration

Igor Simone Stievano, Riccardo Trinchero, N. Tanguy, Mihai Telescu, Marco Atlante
article en

Abstract

This paper presents a method for generating accurate and efficient macromodels of high-speed I/O buffers. Extending existing techniques, the proposed approach enables a modular and scalable model generation tool based on machine-learning. Given the limitations of traditional methods, this work leverages kernel regression to develop SPICE-compliant models. Two compression schemes, random selection and Nyström approximation are used and thoroughly compared to reduce the number of expansion terms, with beneficial effects in terms of compactness of the SPICE implementation. The effectiveness of the method in terms of model accuracy and efficiency is stressed through real devices and typical signal and power integrity co-simulations.

IEEE Transactions on Components Packaging and Manufacturing TechnologyVol. 15(9)
Centre National de la Recherche Scientifique (FR), Université de Bretagne Occidentale (FR), Politecnico di Torino (IT), Laboratoire des Sciences et Techniques de l’Information de la Communication et de la Connaissance (FR)
Openalex Percentile: Top 84%
VLSI and Analog Circuit Testing
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IC Modeling via Machine Learning Regressions: A Data-Driven Approach to SPICE Integration — Igor Simone Stievano, Riccardo Trinchero, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology (2025) | TGRS Research Map | TGRS