Electrical Transport at n-Ga<sub>2</sub>O<sub>3</sub>/n-SiC Hetero-Interface Constructed by Hydrophilic and Surface Activated Bonding

The n-Ga<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf>O<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</inf>/n-SiC (GaOSiC) hetero-structure was achieved by ion-cutting process based on surface activated bonding (SAB) and hydrophilic bonding (HB) techniques. The HB GaOSiC hetero-interface showed an amorphous layer of only ~1 nm, contributing to 16.87% of the total on-resistance (R<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">on,total</inf>) for the GaOSiC structure, which is much less than that of the SAB hetero-interface. The low interface resistance (R<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">i</inf>) of HB GaOSiC structure provides a feasible path towards the vertical β-Ga<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf>O<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</inf> power electronics with high power operating capability and acceptable heat dissipation performance.

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Published
2025-03-09
DOI
https://doi.org/10.1109/edtm61175.2025.11040998
Primary Topic
Ga2O3 and related materials
Type
article
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article

Electrical Transport at n-Ga2O3/n-SiC Hetero-Interface Constructed by Hydrophilic and Surface Activated Bonding

Zhenyu Qu, Haowen Guo, Yeliang Wang, Wenhui Xu et al.
4 links
Ga2O3 and related materials
article

Electrical Transport at n-Ga2O3/n-SiC Hetero-Interface Constructed by Hydrophilic and Surface Activated Bonding

Zhenyu Qu, Haowen Guo, Yeliang Wang, Wenhui Xu, Haodong Jiang, Xin Ou, Min Zhou, Tiancheng Zhao, Tiangui You
article en

Abstract

The n-Ga<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf>O<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</inf>/n-SiC (GaOSiC) hetero-structure was achieved by ion-cutting process based on surface activated bonding (SAB) and hydrophilic bonding (HB) techniques. The HB GaOSiC hetero-interface showed an amorphous layer of only ~1 nm, contributing to 16.87% of the total on-resistance (R<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">on,total</inf>) for the GaOSiC structure, which is much less than that of the SAB hetero-interface. The low interface resistance (R<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">i</inf>) of HB GaOSiC structure provides a feasible path towards the vertical β-Ga<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf>O<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</inf> power electronics with high power operating capability and acceptable heat dissipation performance.

Chinese Academy of Sciences (CN), ShanghaiTech University (CN), Shanghai Institute of Microsystem and Information Technology (CN)
National Natural Science Foundation of China, Science and Technology Commission of Shanghai Municipality
Openalex Percentile: Top 91%
Ga2O3 and related materials
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