Monolithic-Wafer-Based Cascade-Actuation XYZ-Microstage With Large Displacement and Low Crosstalk by Integrating an In-Plane Comb-Drive XY-Microstage With Out-of-Plane Al/SiO<sub>2</sub> Bimorph Actuators

This study innovatively proposes and demonstrates a monolithic-wafer-based cascade-actuation XYZ-microstage featuring large displacement strokes and low-crosstalk movements, achieved by integrating an in-plane comb-drive XY-microstage with out-of-plane Al/SiO<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> bimorph thermoelectric actuators for the first time. A three-level serial kinematic scheme within a monolithic wafer, i.e., a three-level frame-in-frame structural configuration, is employed to mitigate motion crosstalk across the X-, Y-, and Z-axes. In the in-plane comb-drive XY-microstage, which comprises four actuation units, both decoupling-motion structural design and capacitance-coupling crosstalk constraints are implemented to ensure low-crosstalk movements along the ±X- and ±Y-axes. Four sets of out-of-plane Al/SiO<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> bimorph actuators independently actuate the comb-drive XY-microstage along the Z-axis. Additionally, mechanical Si-springs are introduced to facilitate electrical interconnections between the XY-microstage and external pads. This design also overcomes the limitation of out-of-plane stroke space in a monolithic wafer, thereby maximizing the actuation potential to achieve significant out-of-plane displacement. A critical step in the microfabrication process involves the successful creation of high-aspect-ratio silicon combs and Al/SiO<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> bimorphs by engineering “step” structures in the handle layer of an SOI wafer, enabling subsequent structure release. Finally, the fabricated monolithic-wafer-based XYZ-microstage can provide large displacements of <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$92.3~\mu $</tex-math> </inline-formula>m, <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$78.3~\mu $</tex-math> </inline-formula>m, and <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$2.0~\mu $</tex-math> </inline-formula>m in the X-, Y-, and Z-directions, respectively. Furthermore, the three-dimensional cascade-actuation configuration within a monolithic wafer is adaptable to various actuation-mode combinations, facilitating multi-degree-of-freedom actuations.[2025-0021]

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Publication Details

Journal
Journal of Microelectromechanical Systems
Published
2025-06-30
DOI
https://doi.org/10.1109/jmems.2025.3581231
Citations
2
Primary Topic
Advanced Materials and Mechanics
Type
article
Field-Weighted Citation Impact
1.43

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article

Monolithic-Wafer-Based Cascade-Actuation XYZ-Microstage With Large Displacement and Low Crosstalk by Integrating an In-Plane Comb-Drive XY-Microstage With Out-of-Plane Al/SiO2 Bimorph Actuators

Gaopeng Xue, Zengyi Wang, Bing Li, Peipei Shi et al.
2 citations
Journal of Microelectromechanical Systems
Advanced Materials and Mechanics
1.43
article

Monolithic-Wafer-Based Cascade-Actuation XYZ-Microstage With Large Displacement and Low Crosstalk by Integrating an In-Plane Comb-Drive XY-Microstage With Out-of-Plane Al/SiO2 Bimorph Actuators

Gaopeng Xue, Zengyi Wang, Bing Li, Peipei Shi, Jia Ding, Huanyu Dai
article en
2 citations

Abstract

This study innovatively proposes and demonstrates a monolithic-wafer-based cascade-actuation XYZ-microstage featuring large displacement strokes and low-crosstalk movements, achieved by integrating an in-plane comb-drive XY-microstage with out-of-plane Al/SiO<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> bimorph thermoelectric actuators for the first time. A three-level serial kinematic scheme within a monolithic wafer, i.e., a three-level frame-in-frame structural configuration, is employed to mitigate motion crosstalk across the X-, Y-, and Z-axes. In the in-plane comb-drive XY-microstage, which comprises four actuation units, both decoupling-motion structural design and capacitance-coupling crosstalk constraints are implemented to ensure low-crosstalk movements along the ±X- and ±Y-axes. Four sets of out-of-plane Al/SiO<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> bimorph actuators independently actuate the comb-drive XY-microstage along the Z-axis. Additionally, mechanical Si-springs are introduced to facilitate electrical interconnections between the XY-microstage and external pads. This design also overcomes the limitation of out-of-plane stroke space in a monolithic wafer, thereby maximizing the actuation potential to achieve significant out-of-plane displacement. A critical step in the microfabrication process involves the successful creation of high-aspect-ratio silicon combs and Al/SiO<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> bimorphs by engineering “step” structures in the handle layer of an SOI wafer, enabling subsequent structure release. Finally, the fabricated monolithic-wafer-based XYZ-microstage can provide large displacements of <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$92.3~\mu $</tex-math> </inline-formula>m, <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$78.3~\mu $</tex-math> </inline-formula>m, and <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$2.0~\mu $</tex-math> </inline-formula>m in the X-, Y-, and Z-directions, respectively. Furthermore, the three-dimensional cascade-actuation configuration within a monolithic wafer is adaptable to various actuation-mode combinations, facilitating multi-degree-of-freedom actuations.[2025-0021]

Journal of Microelectromechanical SystemsVol. 34(5)
Harbin Institute of Technology (CN)
National Natural Science Foundation of China
Affordable and clean energy
Openalex Percentile: Top 19%
Advanced Materials and Mechanics
1.43
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