Research on the Reliability of Semiconductor Chips under Extreme Conditions and Strategies

Semiconductor chips face multiple challenges such as high temperatures, radiation, and mechanical vibrations in extreme environment applications like aerospace, automotive electronics, and nuclear energy. Their performance stability is crucial for system reliability. This research systematically analyzes the failure modes of chips under the combined action of multiple fields including temperature, radiation, and humidity. By adopting a technical approach that integrates in-situ testing, numerical simulation, and failure analysis, it reveals the primary failure mechanisms, such as gate oxide layer breakdown and metal interconnect electromigration. The novel multi-layer passivation structure and low-stress packaging process offer superior protection against chip failures in extreme environments compared to traditional methods. Future research should focus on in-depth studies of high-k gate dielectric material modifications to improve their radiation tolerance and enhance the overall reliability of chips in radiation-intensive environments.