A Study on the Improvement of HCR Screw Shape in Oxide Etcher Equipment Using TRIZ's 40 Inventive Principles

In today's semiconductor industry, high performance, low power consumption, and advanced miniaturization technologies have emerged as key trends.The increasing demand for cutting-edge technologies such as AI, data centers, and electric vehicles has accelerated the adoption of ultra-fine processes below 3nm, emphasizing the significance of etching processes.Etching is a critical technology that determines the precision of semiconductor circuit patterns and is essential for implementing new materials and structures in semiconductor design.Advanced techniques such as plasma-based dry etching are being introduced to simultaneously achieve micro-pattern implementation and productivity enhancement.However, defects and losses occurring in these fine processes directly impact production efficiency and quality.In particular, issues such as micro-pattern damage, reduced uniformity, and residuals during the etching process are major factors lowering semiconductor yields.Addressing these challenges requires precise process control and ensuring equipment stability, making it crucial to minimize these issues with high-performance equipment.This paper addresses a case study of improving screw wear through screw shape modification caused by temperature increases in the semiconductor etch process.To resolve the screw wear problem, TRIZ's CECA (Cause-Effect Chain Analysis) approach and physical and functional contradiction analysis were employed to define the problem and identify its root causes.By applying TRIZ's 40 Inventive Principles, an Ideal Final Result (IFR) was designed, achieving reduced wear and enhanced durability through screw shape modification.This study demonstrates that TRIZ is an exceptionally effective tool for driving the entire process from problem definition to resolution.It systematically analyzes complex process challenges and derives creative solutions, presenting an innovative approach to simultaneously optimize process efficiency and equipment longevity while proving its utility in the semiconductor industry.